Chin Cheekeong Email

Vice President and GM @ SanDisk Semiconductor (Shanghai) Co. Ltd

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Chin Cheekeong's Location

China

Chin Cheekeong's Work

Vice President and GM @ SanDisk Semiconductor (Shanghai) Co. Ltd
Director Of Engineering @ SanDisk Shanghai, WDC.
Operation Director @ JCET Group

Operation Director @ JCET Group
NPI and R and D Deputy Director @ JCET Group
Engineering and R and D (Shanghai and Taiwan) @ JCET Group
Engineer @ 日月光封装测试（上海）有限公司
Product Engineer @ BOE Varitronix Limited

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Chin Cheekeong's Education

University Putra Malaysia
Bachelor's of Engineering (Processing)
1995 - 1998
Chung Ling High School
STPM (Grade A)
1987 - 1994

Chin Cheekeong's Skills

Copper Wire bonding
New production Production Launching
Flip Chip Packaging

Statistical Analysis
Product and Technology Development
Failure Analysis (Assembly and Reliability)
Process Engineeering
Semiconductors package design
Program Management
Process Engineering

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Chin Cheekeong's Summary

CHIN CheeKeong, based in China, is currently a Vice President and GM at SanDisk Semiconductor (Shanghai) Co. Ltd, bringing experience from previous roles at SanDisk Shanghai, WDC., STATS ChipPAC Ltd. and STATS ChipPAC. CHIN CheeKeong holds a 1995 - 1998 Bachelor's of Engineering in Processing @ University Putra Malaysia. With a robust skill set that includes Copper Wire bonding, New production Production Launching, Flip Chip Packaging, Statistical Analysis, Product and Technology Development and more, CHIN CheeKeong contributes valuable insights to the industry. CHIN CheeKeong has 1 email on RocketReach.