Chi-Ming H.'s Location
Taiwan
Chi-Ming H.'s Work
- Packaging Engineer @ Intel Corporation
- Advanced Interconnect Application Engineer @ DuPont
- Senior R and D Engineer @ TSMC
Chi-Ming H.'s Education
- 國立臺灣大學
Master's degree (Materials Science and Engineering)
- 國立臺灣大學
Bachelor's degree (Materials Science and Engineering)
Chi-Ming H.'s Summary
Chi-Ming H., based in Taiwan, is currently a Packaging Engineer at 英特爾公司, bringing experience from previous roles at 台灣杜邦股份有限公司 and 台積電. Chi-Ming H. holds a Master's degree in Materials Science and Engineering @ 國立臺灣大學. Chi-Ming H. has 1 email on RocketReach.
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