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Cheong Kun Location
Shanghai, China
Cheong Kun Work
VP of Mobile Power @ (January 2022 - Present)
Principal Engineer @ (January 2007 - January 2022)
Engineer @ (August 2005 - January 2007)
Cheong Kun Education
Michigan State University
Master (Electrical and Computer Engineering)
2002-2005
Peking University
Bachelor of Science (B.S.) (Electrical, Electronics and Communications Engineering)
1998-2002
Cheong Kun Skills
Simulations
Semiconductors
Mixed Signal
Embedded Systems
ASIC
Analog
Cadence Virtuoso
Power Management
SoC
Verilog
VLSI
Analog Circuit Design
C
Hardware
Circuit Design
IC
Cheong Kun Summary
Cheong Kun, based in Shanghai, China, is currently a VP of Mobile Power at NuVolta Technologies. Cheong Kun brings experience from previous roles at Qualcomm and Siemens VDO Automotive. Cheong Kun holds a 2002 - 2005 Master in Electrical and Computer Engineering @ Michigan State University. With a robust skill set that includes Simulations, Semiconductors, Mixed Signal, Embedded Systems, ASIC and more. Cheong Kun has 1 emails on RocketReach.
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