Cheng Yang's Location
Shanghai, China
Cheng Yang's Work
Cheng Yang's Education
Washington University in St. Louis - Olin Business School
EMBA (Business Management)
2011 - 2012
National University of Singapore
Ph.D. (Electronics Packaging, advanced thermal management)
1998 - 2001
Shanghai Jiao Tong University
Master (Engineering Thermal Physics)
1989 - 1996
Cheng Yang's Skills
Cheng Yang's Summary
Cheng Yang, based in Shanghai, China, is currently a Senior Director, Advanced Packaging and SiP Design at JCET Group, bringing experience from previous roles at Flex, Intel, GE and Delta Electronics. Cheng Yang holds a 2011 - 2012 EMBA in Business Management @ Washington University in St. Louis - Olin Business School. With a robust skill set that includes Semiconductors, Failure Analysis, Electronics Packaging, Team Leadership, Thermal and more, Cheng Yang contributes valuable insights to the industry. Cheng Yang has 3 emails on RocketReach.