Cheng Chi, based in New York, NY, US, is currently a Manager, Chiplet and 3DIC Design at IBM. Cheng Chi brings experience from previous roles at IBM and IBM Research. Cheng Chi holds a Master's degree in Materials Chemistry @ Fudan University. With a robust skill set that includes Reflection, Polymer Physics, Dark, Diffusion, Chemistry and more. Cheng Chi has 2 emails and 1 mobile phone numbers on RocketReach.
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