Chase Swendrowski Email
Tooling and Packaging Engineer @ QP Technologies
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Chase Swendrowski Location
- San Diego, CA, US
Chase Swendrowski Work
- Tooling and Packaging Engineer @ (June 2026 - Present)
- Temp Services Technician @ (March 2026 - June 2026)
- Bike Technician and Retail Associate @ (October 2025 - May 2026)
- Mechanical Engineer @ Adaptive Dynamics, Inc (March 2023 - September 2023)
- Teaching Assistant @ (January 2022 - December 2022)
Chase Swendrowski Education
- UC San Diego
Master of Science - MS (Mechanical Engineering)
2024 - Missouri University of Science and Technology
Bachelor of Science - BS (Mechanical Engineering)
2022
Chase Swendrowski Skills
- Arduino
- Autodesk Inventor
- MATLAB
- Microsoft Office
- SOLIDWORKS
- Siemens NX
- Testing Process
Chase Swendrowski Summary
- Chase Swendrowski, based in San Diego, CA, US, is currently a Tooling and Packaging Engineer at QP Technologies. Chase Swendrowski brings experience from previous roles at Epsilon Systems Solutions, Inc., DICK'S Sporting Goods, Adaptive Dynamics, Inc and Missouri University of Science and Technology. Chase Swendrowski holds a Master of Science - MS in Mechanical Engineering @ UC San Diego. With a robust skill set that includes Arduino, Autodesk Inventor, MATLAB, Microsoft Office, SOLIDWORKS and more. Chase Swendrowski has 1 emails on RocketReach.
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