C.H Ang's Location

Cupertino, CA, US

C.H Ang's Work

  • Principal Packaging Engineer (LSI) and Packaging and Assembly Technology Manager (C-Cube) @ LSI Logic
  • Sr. Packaging Engineer @ Micro Module System

C.H Ang's Skills

  • Test Engineering
  • Engineering Management
  • Reliability
  • Reliability Engineering
  • PCB design
  • Analog
  • ASIC
  • Electronics
  • VLSI
  • Validation

C.H Ang's Summary

c.h Ang, based in Cupertino, CA, US, is currently a Director Of Technology at TOWA USA INC, bringing experience from previous roles at TOWA USA, Zoran, LSI Logic and Micro Module System. With a robust skill set that includes Test Engineering, Engineering Management, Reliability, Reliability Engineering, PCB design and more, c.h Ang contributes valuable insights to the industry. c.h Ang has 1 email on RocketReach.

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