Cc Lee Email
Head of Hardware Engineering, Ring Asia @ Amazon
5 free lookup(s). No credit card required.
If you need more lookups,
subscriptions start at $34 USD/month.
Cc Lee Location
- Taiwan
Cc Lee Work
- 2020 -now Head of Hardware Engineering, Ring Asia @
- 2017 -2020 President @
- 2012 -2017 Sales Vice President and World Wide System Architecture Officer @
- 2011 -2013 R and D Vice President @
- 1997 -1999 Technical manager @
- 1993 -1996 Engineers @
Cc Lee Education
- 國立清華大學
Master (Electrical Engineering)
1991-1993 - 國立交通大學
Bachelor (Mechanical Engineering)
1986-1990
Cc Lee Skills
- Hardware Architecture
- IP Networking
- Project Engineering
- System Architecture
- Hardware
- Cloud Computing
- IP
- Engineering
- AutoCAD
- SQL
- Strategic Planning
- Management
Cc Lee Summary
- Cc Lee, based in Taiwan, is currently a Head of Hardware Engineering, Ring Asia at Amazon. Cc Lee brings experience from previous roles at 智邦科技 and Advanced Micro Devices. Cc Lee holds a 1991 - 1993 Master in Electrical Engineering @ 國立清華大學. With a robust skill set that includes Hardware Architecture, IP Networking, Project Engineering, System Architecture, Hardware and more. Cc Lee has 2 emails on RocketReach.
Looking for a different Cc Lee?
Find contact details for 700 million professionals.
Top Amazon Employees
Andrew Devore
Vice President and Associate General Counsel
Seattle, WA, US
Justin Cambra
Founder RealEstate@ Amazon
Seattle, WA, US
Allie Oosta
Chief Merchandising Officer, North America Stores
Seattle, WA, US
G2 Crowd Trusted
300K+ Plugin Users
© 2026 RocketReach.co