2020 -now Head of Hardware Engineering, Ring Asia @
2017 -2020 President @
2012 -2017 Sales Vice President and World Wide System Architecture Officer @
2011 -2013 R and D Vice President @
1997 -1999 Technical manager @
1993 -1996 Engineers @
Cc Lee Education
國立清華大學
Master (Electrical Engineering)
1991-1993
國立交通大學
Bachelor (Mechanical Engineering)
1986-1990
Cc Lee Skills
Hardware Architecture
IP Networking
Project Engineering
System Architecture
Hardware
Cloud Computing
IP
Engineering
AutoCAD
SQL
Strategic Planning
Management
Cc Lee Summary
Cc Lee, based in Taiwan, is currently a Head of Hardware Engineering, Ring Asia at Amazon. Cc Lee brings experience from previous roles at 智邦科技 and Advanced Micro Devices. Cc Lee holds a 1991 - 1993 Master in Electrical Engineering @ 國立清華大學. With a robust skill set that includes Hardware Architecture, IP Networking, Project Engineering, System Architecture, Hardware and more. Cc Lee has 2 emails on RocketReach.
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