Senior Principal Software Architect @ (March 2020 - November 2022)
Principal Engineer @ (January 2017 - March 2020)
Principal Engineer @ (April 2013 - January 2017)
Staff Firmware Engineer @ (July 2010 - April 2013)
Platform Architect @ (August 2002 - July 2010)
Lead Software Engineer @ (September 1999 - July 2002)
Software Engineer @ (December 1994 - August 1999)
Carey Smith Education
University of Portland
Electrical Engineering (Computer Engineering)
1989-1993
Carey Smith Skills
TeamCity
Software Project Management
Linux
Device Drivers
Computer Hardware
Network Security
Computer Architecture
Software Development
Strategy
Microsoft SQL Server
Java
EclipseLink
Team Leadership
JAXB
XML Schema
Networking
Embedded Systems
Software Engineering
Agile Project Management
Agile Methodologies
Maven
C
T Sql Stored Procedures
Conference Organization
Embedded Software
Intel
XML
Integration
SQL
Strategic Planning
Systems Engineering
Firmware
Software Architectural Design
x86 Assembly
Debugging
Presentation Skills
Carey Smith Summary
Carey Smith, based in Camas, WA, US, is currently a Senior Director, Engineering at Qualcomm. Carey Smith brings experience from previous roles at Arm and Intel Corporation. Carey Smith holds a 1989 - 1993 Electrical Engineering in Computer Engineering @ University of Portland. With a robust skill set that includes TeamCity, Software Project Management, Linux, Device Drivers, Computer Hardware and more. Carey Smith has 3 emails and 2 mobile phone numbers on RocketReach.
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