Product Line Core Team Lead (NAND Wafer and Component)
@
Western Digital
5 free lookups per month.
Caifu Zeng's Location
Mountain View, CA, US
Caifu Zeng's Work
Product Line Core Team Lead (NAND Wafer and Component) @ Western Digital
Product Development Team Lead (NAND Wafer and Component) @ Western Digital
Product Reliability and Qualification Owner (Mobile and Client Computing) @ Western Digital
Caifu Zeng's Education
University of California, Los Angeles
Doctor of Philosophy (Ph.D.) (Electrical Engineering)
2010 - 2014
University of California, Los Angeles
Master's Degree (Electrical Engineering)
2007 - 2009
Zhejiang University
Bachelor's Degree (Electrical Engineering)
2003 - 2007
Technical University of Lodz
Summer Exchange Student (Electrical and Electronics Engineering)
2006 - 2006
Caifu Zeng's Skills
NAND Flash
Python
Firmware
C/C++
Characterization
Device Characterization
Physics
Simulations
Matlab
Microfabrication
Caifu Zeng's Summary
Caifu Zeng, based in Mountain View, CA, US, is currently a Product Line Core Team Lead (NAND Wafer and Component) at Western Digital, bringing experience from previous roles at Western Digital. Caifu Zeng holds a 2010 - 2014 Doctor of Philosophy (Ph.D.) in Electrical Engineering @ University of California, Los Angeles. With a robust skill set that includes NAND Flash, Python, Firmware, C/C++, Characterization and more, Caifu Zeng contributes valuable insights to the industry. Caifu Zeng has 3 emails and 1 mobile phone number on RocketReach.