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Byeong Lee Location
California, United States
Byeong Lee Work
Logic Module 공정 개발 Sr. Director @ (March 2018 - Present)
Senior Technical Director @ (March 2018 - Present)
Principal Engineer @ Samsung (September 1997 - Present)
Ph.D course student @ 한국과학기술원(KAIST) Ph. D (March 1992 - August 1997)
Byeong Lee Education
한국과학기술원(KAIST)
Doctor of Philosophy - PhD (Materials and Sciences)
1992-1997
한국과학기술원(KAIST)
Doctor of Philosophy (PhD) (재료공학)
1990-1997
Hanyang University
학사 (Materials Engineering)
1986-1990
Byeong Lee Skills
Epitaxial Growth 공정 기술
Strengthening mechanism of Al-Li alloy for airplane materials
Next generation Anneal process developement, Flash & Laser Anneal
Logic Source & Drain Module developement, eSiGe & eSD SEG
DRAM FEOL Process developement, STI, Gox, Gate & S/D junction
Diffusion (LPCVD, ALD) & Ion implantation process
7nm Logic Process Developement, Fin/PC/SD/RPG/RMG/CNT/BEOL Module
Leadership
Customer Service
SQL
Dram Feol Process Developement
Gox
Ald and Ion Implantation Process
Flash and Laser Anneal
7nm Logic Process Developement
Esige and Esd Seg
Diffusion Lpcvd
Next Generation Anneal Process Developement
Logic Source and Drain Module Developement
Strengthening Mechanism of Al Li Alloy for Airplane Materials
Gate and S/D Junction
Fin/Pc/Sd/Rpg/Rmg/Cnt/Beol Module
Sti
Diffusion and Ion Implantation Process
Byeong Lee Summary
Byeong Lee, based in California, United States, is currently a Logic Module 공정 개발 Sr. Director at Applied Materials. Byeong Lee brings experience from previous roles at Applied Materials, Samsung and 한국과학기술원(KAIST) Ph. D. Byeong Lee holds a 1992 - 1997 Doctor of Philosophy - PhD in Materials and Sciences @ 한국과학기술원(KAIST). With a robust skill set that includes Epitaxial Growth 공정 기술, Strengthening mechanism of Al-Li alloy for airplane materials, Next generation Anneal process developement, Flash & Laser Anneal, Logic Source & Drain Module developement, eSiGe & eSD SEG, DRAM FEOL Process developement, STI, Gox, Gate & S/D junction and more. Byeong Lee has 1 emails on RocketReach.
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