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Bryan Wiggins Location
Hillsboro, OR, US
Bryan Wiggins Work
Substrate Process Integration Development Engineer @ (June 2026 - Present)
Packaging Development Technologist @ (September 2025 - June 2026)
Packaging R and D Engineer @ (October 2019 - September 2025)
Process Engineer @ (June 2016 - October 2019)
Provost's Postdoctoral Scholar @ The University of Chicago (January 2014 - May 2016)
Postdoctoral Research Associate @ (May 2013 - November 2013)
Research Assistant @ (August 2008 - May 2013)
Intern @ (January 2008 - July 2008)
Intern @ (June 2007 - August 2007)
Bryan Wiggins Education
Washington State University
PhD (Materials Science and Engineering)
2008-2013
Alabama Agricultural and Mechanical University
B.S. (Chemistry)
2003-2007
Bryan Wiggins Skills
Characterization
Chemistry
Experimentation
FTIR
Low Energy Electron Diffraction (LEED)
Materials
Microscopy
Nanomaterials
Nanostructures
Nanotechnology
Organic Chemistry
STM
Scanning Tunneling Microscopy
Sensors
Spectroscopy
Surface
Thin Films
UHV
UV/Vis
UV/Vis Spectroscopy
Ultra High Vacuum (UHV)
Ultraviolet Photoelectron Spectroscopy (UPS)
Vapor Deposition
X-ray Photoelectron Spectroscopy
XPS
X Ray Photoelectron Spectroscopy
Ultraviolet Photoelectron Spectroscopy Ups
Ultra High Vacuum Uhv
Low Energy Electron Diffraction Leed
Ultra High Vacuum
Ultraviolet Photoelectron Spectroscopy
Low Energy Electron Diffraction
Bryan Wiggins Summary
Bryan Wiggins, based in Hillsboro, OR, US, is currently a Substrate Process Integration Development Engineer at Intel. Bryan Wiggins brings experience from previous roles at Intel and The University of Chicago. Bryan Wiggins holds a 2008 - 2013 PhD in Materials Science and Engineering @ Washington State University. With a robust skill set that includes Characterization, Chemistry, Experimentation, FTIR, Low Energy Electron Diffraction (LEED) and more. Bryan Wiggins has 4 emails and 2 mobile phone numbers on RocketReach.
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