Bryan Lai Email
AVP, Head of R and D @ SANGEAN ELECTRONICS INC.
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Bryan Lai Location
- Taipei City, Taiwan, Taiwan
Bryan Lai Work
- AVP, Head of R and D @ (December 2024 - Present)
- R and D Senior Director @ (February 2020 - April 2024)
- R and D director @ (April 2016 - December 2020)
- Sr. Manager, R and D Engineering, TTC @ (July 1997 - March 2016)
Bryan Lai Skills
- Embedded Systems
- Electronics
- Testing
- Public Speaking
- Strategy
- Hardware
- Sales
- Hardware Engineering
- Business Strategy
- Leadership
- Six Sigma
- Hardware Architecture
- Research and Development
- Engineering Management
- Debugging
- Technical Leadership
- Team Leadership
- DOCSIS
- Engineering
- Bluetooth
- Product Lifecycle Management
- Product R&d
- Motorola Balckbelt
- Cross Functional Team Leadership
- Design of Experiments
- Product Management
- Global R&d
- Management
- Design
- Product Development
- Integration
Bryan Lai Summary
- Bryan Lai, based in Taipei City, Taiwan, Taiwan, is currently a AVP, Head of R and D at SANGEAN ELECTRONICS INC.. Bryan Lai brings experience from previous roles at DediProg Technology, New Kinpo Group and ARRIS. With a robust skill set that includes Embedded Systems, Electronics, Testing, Public Speaking, Strategy and more. Bryan Lai has 1 emails on RocketReach.
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