Principal System and Architecture Engineer @ (April 2022 - April 2024)
Senior Principal Engineer @ (May 2021 - April 2022)
Senior Hardware Engineer @ (January 2021 - May 2021)
Senior Application Engineer @ (April 2017 - January 2021)
Advanced Engineer @ (July 2016 - April 2017)
Senior Applications Engineer (Automotive) @ (March 2013 - June 2016)
Applications Engineer (Handheld Power) @ (June 2006 - March 2013)
Co-Op Applications Engineer @ (June 2005 - December 2005)
Bryan Dick Education
University of Arizona
Bachelor of Science (BS) (Electrical and Electronics Engineering)
2000-2006
Bryan Dick Skills
Semiconductors
Debugging
Mixed Signal
PCB design
Analog
Electronics
Labview
Power Management
Electrical Engineering
Soldering
Consumer Electronics
Automotive Infotainment
PCB layout design
Circuit Design
Automotive Electronics
SPICE
Infotainment
IC
Bryan Dick Summary
Bryan Dick, based in Chandler, AZ, US, is currently a Field Application Engineering Manager - Americas at Taiwan Semiconductor. Bryan Dick brings experience from previous roles at Moog Space and Defense Group, NXP Semiconductors, Northrop Grumman and Eberle Design, Inc.. Bryan Dick holds a 2000 - 2006 Bachelor of Science (BS) in Electrical and Electronics Engineering @ University of Arizona. With a robust skill set that includes Semiconductors, Debugging, Mixed Signal, PCB design, Analog and more. Bryan Dick has 2 emails and 1 mobile phone numbers on RocketReach.
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