Bruno Eichler Email
Head of Hardware-in-the-Loop(HiL) Development @ MicroNova
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Bruno Eichler Location
- Dachau, BY, DE
Bruno Eichler Work
- Head of Hardware-in-the-Loop(HiL) Development @ (September 2019 - Present)
- Manager Analysis-Group and EQC Engineering @ (April 2017 - September 2019)
- Assistant Manager Analysis-Group and EQC Engineering @ (April 2015 - March 2017)
- Team Leader EQC @ (April 2014 - March 2015)
- Senior Analysis Engineer @ (April 2013 - March 2014)
- Analysis Engineer @ (December 2008 - March 2013)
- Group Lead Problemmanagement EA-452 BMW-AG @ (May 2008 - November 2008)
- Problemmanager at BMW-AG EA-452 (Baureihen L6, L6W, L2) @ (October 2007 - May 2008)
Bruno Eichler Education
- Hochschule München University of Applied Sciences
Master-Degree Electrical Engineering ((without final degree))
2009-2011 - Hochschule Esslingen - University of Applied Sciences
Dipl.Ing.(FH) Elektrotechnik / Mikrosystemtechnik
2003-2007
Bruno Eichler Summary
- Bruno Eichler, based in Dachau, BY, DE, is currently a Head of Hardware-in-the-Loop(HiL) Development at MicroNova. Bruno Eichler brings experience from previous roles at ALPS ALPINE Europe. Bruno Eichler holds a 2009 - 2011 Master-Degree Electrical Engineering in (without final degree) @ Hochschule München University of Applied Sciences. Bruno Eichler has 1 emails on RocketReach.
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