Brian Stump Email
Senior RFIC Design Engineer @ Teledyne LeCroy
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Brian Stump Location
- Austin, TX, US
Brian Stump Work
- 2025 -now Senior RFIC Design Engineer @
- 2021 -2025 Senior Analog IC Design Engineer @
- 2018 -2021 Staff System Design Engineer @ Silicon Labs
- 2011 -2018 Senior RF Design Engineer @
- 2010 -2010 RF Design Intern @ Medtronic
- 2007 -2008 Analog Intern @
Brian Stump Education
- University of Michigan
Masters of Science (Applied Electromagnetics and RF Circuits)
2009-2010 - Auburn University
Bachelors (Electrical Engineering)
2005-2009
Brian Stump Summary
- Brian Stump, based in Austin, TX, US, is currently a Senior RFIC Design Engineer at Teledyne LeCroy. Brian Stump brings experience from previous roles at Uhnder, Inc., Silicon Labs, National Instruments and Medtronic. Brian Stump holds a 2009 - 2010 Masters of Science in Applied Electromagnetics and RF Circuits @ University of Michigan. Brian Stump has 1 emails on RocketReach.
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