Brian Stevens Email & Phone Number
Vice President @ NXP Semiconductors
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Brian Stevens Location
- Lake Forest, CA, US
Brian Stevens Work
- 2021 -now Vice President @
- 2016 -2021 Sr. Director of Product Engineering @
- 2016 -2016 Director Product, Test and Supply chain @
Brian Stevens Education
- UCI
Master of Science (MS) (Electrical, Electronics and Communications Engineering)
2001-2003
Brian Stevens Skills
- ASIC
- IC
- Semiconductors
- SoC
- Mixed Signal
- Semiconductor Industry
- Embedded Software
- Analog
- CMOS
- Embedded Systems
- EDA
- Cross-functional Team Leadership
- Debugging
- Analog Circuit Design
- Integrated Circuit Design
- Product Engineering
- Verilog
- Hardware Architecture
- VLSI
- Circuit Design
- FPGA
- RTL design
- Digital Signal Processors
- Cadence Virtuoso
- Application-Specific Integrated Circuits (ASIC)
- Integrated Circuits (IC)
- System on a Chip (SoC)
- Application Specific Integrated Circuits Asic
- Integrated Circuits Ic
- Marketing
- Logistics
- Project Management
- System on a Chip Soc
- Strategic Planning
- Cross Functional Team Leadership
- Engineering
- Management
- Microsoft Excel
- Integrated Circuits
- Application Specific Integrated Circuits
- System on a Chip
Brian Stevens Summary
- Brian Stevens, based in Lake Forest, CA, US, is currently a Vice President at NXP Semiconductors. Brian Stevens brings experience from previous roles at NXP Semiconductors and Broadcom. Brian Stevens holds a 2001 - 2003 Master of Science (MS) in Electrical, Electronics and Communications Engineering @ UCI. With a robust skill set that includes ASIC, IC, Semiconductors, SoC, Mixed Signal and more. Brian Stevens has 3 emails and 2 mobile phone numbers on RocketReach.
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