Brian Loh Email & Phone Number
Lead Hardware Engineer @ Augmental
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Brian Loh Location
- California, United States
Brian Loh Work
- Lead Hardware Engineer @ (September 2024 - Present)
- Electrical Engineer II, HoloLens @ (November 2020 - September 2024)
- Electrical Engineer, Surface @ (August 2019 - November 2020)
- Admission Ambassador and Tour Guide @ USC Office of Admission (September 2015 - August 2019)
- Head Admission Ambassador @ USC Office of Admission (May 2017 - May 2018)
- Admission Center Trainer @ USC Office of Admission (May 2016 - May 2017)
- Electrical Engineering Intern @ Microsoft Surface (May 2018 - August 2018)
- Resident Assistant @ USC Office of Residential Education (August 2016 - May 2018)
- Student Exchange Researcher @ (June 2017 - July 2017)
Brian Loh Education
- University of Southern California
Master of Science - MS (Electrical and Electronics Engineering)
2018-2020 - University of Southern California
Bachelor of Science - BS (Electrical and Electronics Engineering)
2015-2019
Brian Loh Skills
- Bill of Materials (BOM) Management
- Board Bring-up
- Conflict Resolution
- Contract Manufacturing
- Debugging
- Failure Analysis
- Leadership
- Peer Mentoring
- Printed Circuit Board (PCB) Design
- Prototyping
- Public Speaking
- Schematic Capture
Brian Loh Summary
- Brian Loh, based in California, United States, is currently a Lead Hardware Engineer at Augmental. Brian Loh brings experience from previous roles at Microsoft and USC Office of Admission. Brian Loh holds a 2018 - 2020 Master of Science - MS in Electrical and Electronics Engineering @ University of Southern California. With a robust skill set that includes Bill of Materials (BOM) Management, Board Bring-up, Conflict Resolution, Contract Manufacturing, Debugging and more. Brian Loh has 1 emails on RocketReach.
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