Brian Lefevre Location
Pocatello, ID, US
Brian Lefevre Work
- 2024 - now Principal Design Engineer @ Triad Semiconductor
- 2022 - 2024 Principal Circuit Design and Systems Engineer @ onsemi
- 2017 - 2022 Analog Design Lead - Embedded Design Team @ onsemi
- 2007 - 2018 Technical Lead @ onsemi
- 2007 - 2011 Adjunct Electrical Engineering Professor @ Idaho State University
- 2003 - 2007 Staff Analog and RF ASIC Design Engineer @ onsemi
- 2000 - 2001 Engineer Intern @ Agilent Technologies
Brian Lefevre Education
- Brigham Young University
MS BS (Electrical Engineering)
1995 - 2003
Brian Lefevre Skills
- Troubleshooting
- Schematic Capture
- Communication
- Embedded C
- C++
- MATLAB
- Mixed-Signal Integrated Circuits
- Embedded Systems
- Engineering
- Verilog
Brian Lefevre Summary
Brian Lefevre, based in Pocatello, ID, US, is currently a Principal Design Engineer at Triad Semiconductor. Brian Lefevre brings experience from previous roles at onsemi and Idaho State University. Brian Lefevre holds a 1995 - 2003 MS BS in Electrical Engineering @ Brigham Young University. With a robust skill set that includes Troubleshooting, Schematic Capture, Communication, Embedded C, C++ and more. Brian Lefevre has 2 emails and 1 mobile phone numbers on RocketReach.
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