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Brian Lefevre Location
Pocatello, ID, US
Brian Lefevre Work
2024 -now Principal Design Engineer @
2022 -2024 Principal Circuit Design and Systems Engineer @
2017 -2022 Analog Design Lead - Embedded Design Team @
2007 -2018 Technical Lead @
2003 -2007 Staff Analog and RF ASIC Design Engineer @
2007 -2011 Adjunct Electrical Engineering Professor @
2000 -2001 Engineer Intern @
Brian Lefevre Education
Brigham Young University
MS BS (Electrical Engineering)
1995-2003
Brian Lefevre Skills
Troubleshooting
Schematic Capture
Communication
Embedded C
C++
MATLAB
Mixed-Signal Integrated Circuits
Embedded Systems
Engineering
Verilog
ARM Cortex-M
Python (Programming Language)
SystemVerilog
Requirements Gathering
Firmware
CMOS
Analog Circuit Design
Mixed-Signal IC Design
Integrated Circuit Design
Cadence
Verilog-AMS
ASIC
Logic Synthesis
RF
VLSI
Electrical Engineering
Verilog-A
Brian Lefevre Summary
Brian Lefevre, based in Pocatello, ID, US, is currently a Principal Design Engineer at Triad Semiconductor. Brian Lefevre brings experience from previous roles at onsemi and ON Semiconductor. Brian Lefevre holds a 1995 - 2003 MS BS in Electrical Engineering @ Brigham Young University. With a robust skill set that includes Troubleshooting, Schematic Capture, Communication, Embedded C, C++ and more. Brian Lefevre has 2 emails and 3 mobile phone numbers on RocketReach.
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