Mechanical Engineer @ Magic Leap (November 2018 - August 2021)
Payload Development Graduate Co-op @ (January 2017 - August 2017)
Engineering Intern @ (June 2016 - January 2017)
Engineering Intern @ (May 2015 - August 2015)
Mechanical Engineering Intern @ (June 2014 - July 2014)
Disney College Program Intern @ (January 2013 - May 2013)
Brian Heckman Education
University of Colorado Boulder
Master’s Degree (Mechanical Engineering)
2016-2018
Baylor University
Bachelor's Degree (Mechanical Engineering)
2011-2015
Brian Heckman Skills
3D Modeling
AutoCAD
CAD
Consumer Electronics
Consumer Products
Control Systems Design
Creo
Customer Service
DFA
Data Analysis
Design for Assembly
Electronic Products
Engineering
Engineering Design
Feedback Control Systems
Finite Element Analysis
Geometric Dimensioning & Tolerancing
Human Factors
Injection Molding
Leadership
MathCAD
Matlab
Maya
Mechanical Assemblies
Mechanical Engineering
Microsoft Excel
Microsoft Office
Microsoft Word
PowerPoint
Product Design
Product Development
Public Speaking
Recruiting
Siemens NX
Software Validation
Solidworks
Teaching
Teamwork
Testing
Time Management
Tolerance Analysis
Wearable Technology
Geometric Dimensioning and Tolerancing
Brian Heckman Summary
Brian Heckman, based in Orlando, FL, US, is currently a Staff Mechanical Hardware Engineer at Magic Leap. Brian Heckman brings experience from previous roles at Magic Leap, NASA Jet Propulsion Laboratory and Woodward, Inc.. Brian Heckman holds a 2016 - 2018 Master’s Degree in Mechanical Engineering @ University of Colorado Boulder. With a robust skill set that includes 3D Modeling, AutoCAD, CAD, Consumer Electronics, Consumer Products and more. Brian Heckman has 3 emails and 3 mobile phone numbers on RocketReach.
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