Brian Gokey Email & Phone Number
VP - Wafer Level Packaging - GM @ MacDermid Alpha Electronics Solutions
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Brian Gokey Location
- West Haven, CT, US
Brian Gokey Work
- VP - Wafer Level Packaging - GM @ (January 2026 - Present)
- Director, IC Substrates - Circuitry Solutions @ (January 2024 - January 2026)
- Director, Advanced Integrated Metallization - Wafer Level Packaging @ (August 2023 - February 2024)
- Sr. Manager - Wafer Materials - WLP @ (June 2022 - August 2023)
- Group Product Manager @ (January 2020 - June 2022)
- Applications Manager North America and Europe - Semiconductor Solutions @ (November 2013 - January 2020)
- Technical Service Engineer (Six Sigma Black Belt) @ Enthone, Inc (December 2006 - November 2013)
- Technical Co-ordindator @ (January 1998 - January 2006)
- VDF Process Owner @ (January 2000 - October 2001)
- Metalization Technician @ (April 1994 - March 1996)
Brian Gokey Education
- Richland College
- Worcester State University
Brian Gokey Skills
- Six Sigma
- Semiconductors
- Electroplating
- SPC
- Plating
- Design of Experiments
- Thin Films
- Chemistry
Brian Gokey Summary
- Brian Gokey, based in West Haven, CT, US, is currently a VP - Wafer Level Packaging - GM at MacDermid Alpha Electronics Solutions. Brian Gokey brings experience from previous roles at MacDermid Alpha Electronics Solutions. Brian Gokey holds a Richland College. With a robust skill set that includes Six Sigma, Semiconductors, Electroplating, SPC, Plating and more. Brian Gokey has 1 emails and 1 mobile phone numbers on RocketReach.
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