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Brian Fairchild Location
Stow, OH, US
Brian Fairchild Work
Lead W and C Application and Formulation Development Engineer @ (January 2022 - Present)
Lead Application Development, Technical Service Engineer at Avient Corporation @ (July 2020 - February 2022)
Application Development Technical Service Engineer - PolyOne Corporation @ PolyOne (January 2017 - Present)
Technical Development Manager @ PolyOne (April 2015 - Present)
AET Design Engineer @ (August 2014 - April 2015)
Lead R and D Scientist @ PolyOne (October 2007 - August 2014)
Product Scientist @ (July 2006 - September 2007)
Product Manager @ (May 1995 - June 2005)
Brian Fairchild Education
The University of Akron
Certificate (Management of Technology)
2003-2005
Mount Vernon Nazarene University
Bachelor of Arts (BA) (Chemistry)
1988-1991
Brian Fairchild Skills
Polymer Science
Engineering
Customer Relations
Polymers
Compounding
Plastics
Injection Molding
Product Development
Thermoplastics
R&D
Materials
Additives
Extrusion
Customer Service
Elastomers
Lean Manufacturing
Market Development
Polyurethane
Resin
Polymer Compounding
Nanomaterials
Thermoplastic Elastomers
Plastics Compounding
Nanotechnology
Material Selection
Plastic Extrusion
Molding
Plastics Engineering
Materials Science
Polymer Chemistry
Polymer Characterization
Design of Experiments
Process Engineering
Chemistry
Teamwork
Brian Fairchild Summary
Brian Fairchild, based in Stow, OH, US, is currently a Lead W and C Application and Formulation Development Engineer at Avient Corporation. Brian Fairchild brings experience from previous roles at Avient Corporation, PolyOne and GrafTech International. Brian Fairchild holds a 2003 - 2005 Certificate in Management of Technology @ The University of Akron. With a robust skill set that includes Polymer Science, Engineering, Customer Relations, Polymers, Compounding and more. Brian Fairchild has 3 emails and 1 mobile phone numbers on RocketReach.
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