Brian Condie Email & Phone Number
Sr Principal Engineer @ MACOM
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Brian Condie Location
- United States
Brian Condie Work
- 2024 -now Sr Principal Engineer @
- 2022 -2024 Staff Industrialization Engineer @
- 2021 -2022 Reliability Engineer @
- 2018 -2021 Staff RF Packaging Engineer @
- 2012 -2018 Staff RF Packaging Engineer @
- 2010 -2012 Failure Analysis Engineer @
- 2009 -2010 Support and Development Failure Analysis Manager @
- 2007 -2009 Senior Failure Analysis Engineer @
- 1997 -2007 Senior Package Development Engineer @ Freescale (now NXP)
Brian Condie Education
- UNIVERSITY OF ARIZONA, College of Engineering & Mines
BS (Materials Science and Engineering)
1994-1997 - ARIZONA STATE UNIVERSITY, Ira A. Fulton School of Engineering12
(Materials Science and Engineering)
Brian Condie Skills
- Reliability
- Die
- Semiconductors
- Packaging
- Product Development
- Integrated Circuits Ic
- CMOS
- Semiconductor Industry
- RF
- Failure Analysis
- Manufacturing
- Wafer
- Radio Frequency Rf
- Analysis
- Characterization
- Yield
- IC
- Integrated Circuits
- Radio Frequency
Brian Condie Summary
- Brian Condie, based in United States, is currently a Sr Principal Engineer at MACOM. Brian Condie brings experience from previous roles at Tesla, Wolfspeed and Infineon Technologies. Brian Condie holds a 1994 - 1997 BS in Materials Science and Engineering @ UNIVERSITY OF ARIZONA, College of Engineering & Mines. With a robust skill set that includes Reliability, Die, Semiconductors, Packaging, Product Development and more. Brian Condie has 2 emails and 1 mobile phone numbers on RocketReach.
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