Brian Chia Email
Global Payments Solutions Analyst @ Bank of America
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Brian Chia Location
- Hong Kong
Brian Chia Work
- 2024 -now Global Payments Solutions Analyst @
- 2023 -2024 Managing Director @
- 2022 -2023 Head of Liaison @
- 2022 -2022 Head of Operations and Partnerships @
- 2021 -2021 Consultant @
- 2023 -2023 Summer Analyst @
- 2022 -2022 Strategy Analyst Intern @
- 2021 -2021 Business Development Intern @
Brian Chia Education
- The University of Hong Kong
Bachelor's degree (BIOLOGICAL AND BIOMEDICAL SCIENCES)
2020-2024 - Renaissance College Hong Kong
International Baccalaureate Diploma with Bilingual Status
2008-2019
Brian Chia Summary
- Brian Chia, based in Hong Kong, is currently a Global Payments Solutions Analyst at Bank of America. Brian Chia brings experience from previous roles at The Eureka Consulting Group Limited. Brian Chia holds a 2020 - 2024 Bachelor's degree in BIOLOGICAL AND BIOMEDICAL SCIENCES @ The University of Hong Kong. Brian Chia has 1 emails on RocketReach.
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