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Brian Chia Location
Hong Kong
Brian Chia Work
Global Payments Solutions Analyst @ (July 2024 - Present)
Managing Director @ (August 2023 - May 2024)
Head of Liaison @ (August 2022 - August 2023)
Head of Operations and Partnerships @ (January 2022 - August 2022)
Consultant @ (September 2021 - December 2021)
Summer Analyst @ (June 2023 - August 2023)
Strategy Analyst Intern @ (June 2022 - August 2022)
Business Development Intern @ (June 2021 - July 2021)
Brian Chia Education
The University of Hong Kong
Bachelor's degree (BIOLOGICAL AND BIOMEDICAL SCIENCES)
2020-2024
Renaissance College Hong Kong
International Baccalaureate Diploma with Bilingual Status
2008-2019
Brian Chia Summary
Brian Chia, based in Hong Kong, is currently a Global Payments Solutions Analyst at Bank of America. Brian Chia brings experience from previous roles at The Eureka Consulting Group Limited. Brian Chia holds a 2020 - 2024 Bachelor's degree in BIOLOGICAL AND BIOMEDICAL SCIENCES @ The University of Hong Kong. Brian Chia has 1 emails on RocketReach.
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