Brandon Farber Email
VIP Semiconductors@Birck Team Lead @ Purdue Vertically Integrated Projects (Vip)
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Brandon Farber Location
- Westfield, IN, US
Brandon Farber Work
- VIP Semiconductors@Birck Team Lead @ (January 2025 - Present)
- Summer Undergraduate Research Fellow (SURF) @ (June 2026 - July 2026)
- Research Internship @ (May 2025 - August 2025)
- Research Internship @ (February 2024 - May 2025)
- Intern @ (June 2023 - July 2023)
- Sales Floor Associate @ (September 2021 - June 2023)
- Volunteer @ (June 2022 - July 2022)
Brandon Farber Education
- Purdue University
Bachelor's degree
2023-2027 - Hamilton Southeastern High School 2019-2023
Brandon Farber Skills
- 3D Printing
- Acoustic Measurement
- Arduino
- Arduino IDE
- Breadboard
- CNC Manufacturing
- Clean Room
- Computer-Aided Design (CAD)
- Critical Thinking
- Customer Service
- Defect Reduction
- Digital Multimeter (DMM)
- Double Bass
- Electrical Wiring
- Epitaxy
- Etching
- KLA 8920
- KLA SP1
- Laser Cutting
- Literature Review
- Lithography
- MATLAB
- Metalworking
- Microsoft Excel
- Microsoft Office
- Microsoft Word
- Networking
- Oscilloscope
- Photolithography
- Project
- Project Management
- Public Speaking
- Python (Programming Language)
- RF Testing
- ROBOTC
- Reactive Ion Etching
- Research Skills
- Sales
- Self-Motivation
- Subcritical Pile
- SystemVerilog
- Team Leadership
- Teamwork
- TensorFlow
- Verliog
- Waveform Generators
- WiFi
- Wireless Networking
- Woodworking
Brandon Farber Summary
- Brandon Farber, based in Westfield, IN, US, is currently a VIP Semiconductors@Birck Team Lead at Purdue Vertically Integrated Projects (VIP). Brandon Farber brings experience from previous roles at Purdue University, MIT Lincoln Laboratory and The Audio Of Things, LLC. Brandon Farber holds a 2023 - 2027 Bachelor's degree @ Purdue University. With a robust skill set that includes 3D Printing, Acoustic Measurement, Arduino, Arduino IDE, Breadboard and more. Brandon Farber has 1 emails on RocketReach.
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