Brad Wu Email

Packaging Engineer (Taipei team lead) @ HP

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Brad Wu's Location

Taipei City, Taiwan, Taiwan

Brad Wu's Work

Packaging Engineer (Taipei team lead) @ HP
Sr. Packaging engineer @ ModusLink
Packaging Engineer @ APC by Schneider Electric

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Packaging Engineer @ Inventec

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Brad Wu's Education

National Chin-Yi Institute of Technology

Brad Wu's Skills

Packaging
Information Technology
Troubleshooting

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Packaging Testing
Program Management
Supply Chain Management
Testing
Package Testing
Lean Manufacturing
Vendor Management

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Brad Wu's Summary

Brad Wu, based in Taipei City, Taiwan, Taiwan, is currently a Packaging Engineer (Taipei team lead) at HP Inc., bringing experience from previous roles at ModusLink, American Power Conversion and Inventec. Brad Wu holds a National Chin-Yi Institute of Technology. With a robust skill set that includes Packaging, Information Technology, Troubleshooting, Packaging Testing, Program Management and more, Brad Wu contributes valuable insights to the industry. Brad Wu has 1 email on RocketReach.

Brad Wu Email Address

Found 1 email address listing:

@yahoo.com

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