Boon Ee Email
PMTS Engineer Advanced Packaging Development @ AMD
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Boon Ee Location
- Bayan Lepas, MY
Boon Ee Work
- 2024 -now PMTS Engineer Advanced Packaging Development @
- 2017 -2024 Manufacturing Principal Engineer @
- 2010 -2016 Senior FCBGA Assembly Engineering Manager @ Intel technology SDN BHD
- 2006 -2009 Senior Assembly Technology Development Engineer @ Intel techcnology SDN BHD
Boon Ee Education
- City and Guilds of London Institute
(Advance Electrical and Electronics Engineering Systems)
1991-1994 - Institute Technology and Pengurusan Victoria.
(Electrical & Electronic Engineering, Applied Mechanic, Advanced Electrical Technology)
1991-1994
Boon Ee Skills
- Engineering Management
- Semiconductors
- Manufacturing
- Engineering
- Design of Experiments
- Electronics
- Electrical Engineering
- Lean Manufacturing
- Continuous Improvement
- Six Sigma
- FMEA
- SPC
- Product Development
- Design for Manufacturing
- Testing
- Automation
Boon Ee Summary
- Boon Ee, based in Bayan Lepas, MY, is currently a PMTS Engineer Advanced Packaging Development at AMD. Boon Ee brings experience from previous roles at Intel Corporation, Intel technology SDN BHD and Intel techcnology SDN BHD. Boon Ee holds a 1991 - 1994 City and Guilds of London Institute. With a robust skill set that includes Engineering Management, Semiconductors, Manufacturing, Engineering, Design of Experiments and more. Boon Ee has 3 emails on RocketReach.
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