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Bo Yao Location
Hillsboro, OR, US
Bo Yao Work
Staff Software Engineer @ (April 2020 - Present)
Product Development Engineer @ (April 2014 - April 2020)
Research Assistant @ Purdue Univeristy (August 2008 - December 2013)
Visiting Researcher @ Intel (March 2012 - February 2013)
Research Assistant @ (September 2005 - July 2008)
Intern @ Anshan Chemical Industry Equipment Co.LTD, Beijing, China (July 2005 - September 2005)
Research Assistant @ (March 2005 - June 2005)
Intern @ (July 2004 - August 2004)
Bo Yao Education
Purdue University
PhD (ECE (VLSI Testing, Design-for-Test))
2008-2013
Peking University
M.S. (EECS (SoC Design--DFT, Physical Design))
2005-2008
Tsinghua University
B.E. (EE (Microelectronics))
2001-2005
Bo Yao Skills
Verilog
Computer Architecture
SPICE
VHDL
TCL
Perl
C
C++
ModelSim
Physical Design
Parallel Programming
DFT
Compilers
Csh
Primetime
Virtuoso
Tetramax
Matlab
VLSI
Algorithms
Logic Design
Static Timing Analysis
Formal Verification
Development
Intel
Product Development
Very Large Scale Integration Vlsi
Yield
Bo Yao Summary
Bo Yao, based in Hillsboro, OR, US, is currently a Staff Software Engineer at Intel Corporation. Bo Yao brings experience from previous roles at Intel Corporation, Purdue Univeristy, Intel and Peking University. Bo Yao holds a 2008 - 2013 PhD in ECE (VLSI Testing, Design-for-Test) @ Purdue University. With a robust skill set that includes Verilog, Computer Architecture, SPICE, VHDL, TCL and more. Bo Yao has 4 emails and 1 mobile phone numbers on RocketReach.
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