Bo Yao Email & Phone Number
Staff Software Engineer @ Intel Corporation
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Bo Yao Location
- Hillsboro, OR, US
Bo Yao Work
- 2020 -now Staff Software Engineer @
- 2014 -2020 Product Development Engineer @
- 2008 -2013 Research Assistant @ Purdue Univeristy
- 2012 -2013 Visiting Researcher @ Intel
- 2005 -2008 Research Assistant @
- 2005 -2005 Intern @ Anshan Chemical Industry Equipment Co.LTD, Beijing, China
- 2005 -2005 Research Assistant @
- 2004 -2004 Intern @
Bo Yao Education
- Purdue University
PhD (ECE (VLSI Testing, Design-for-Test))
2008-2013 - Peking University
M.S. (EECS (SoC Design--DFT, Physical Design))
2005-2008 - Tsinghua University
B.E. (EE (Microelectronics))
2001-2005
Bo Yao Skills
- Verilog
- Computer Architecture
- SPICE
- VHDL
- TCL
- Perl
- C
- C++
- ModelSim
- Physical Design
- Parallel Programming
- DFT
- Compilers
- Csh
- Primetime
- Virtuoso
- Tetramax
- Matlab
- VLSI
- Algorithms
- Logic Design
- Static Timing Analysis
- Formal Verification
- Development
- Intel
- Product Development
- Very Large Scale Integration Vlsi
- Yield
Bo Yao Summary
- Bo Yao, based in Hillsboro, OR, US, is currently a Staff Software Engineer at Intel Corporation. Bo Yao brings experience from previous roles at Intel Corporation, Purdue Univeristy, Intel and Peking University. Bo Yao holds a 2008 - 2013 PhD in ECE (VLSI Testing, Design-for-Test) @ Purdue University. With a robust skill set that includes Verilog, Computer Architecture, SPICE, VHDL, TCL and more. Bo Yao has 4 emails and 1 mobile phone numbers on RocketReach.
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