Bo Feng Email

Bo Feng Email

AE Director of Power Module SiC and IGBT @ onsemi

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Bo Feng's Location

Shanghai, China

Bo Feng's Work

  • AE Director of Power Module SiC and IGBT @ onsemi
  • Program manager @ Eaton
  • Sr. Power Supply engineer and Power architect @ Intel Corporation

Bo Feng's Education

  • 2000 - 2004

Bo Feng's Skills

  • Embedded Systems
  • Semiconductors
  • Electronics
  • Simulations
  • Analog
  • Electrical Engineering
  • PCB design
  • Analog Circuit Design
  • Power Electronics
  • Hardware Architecture

Bo Feng's Summary

Bo Feng, based in Shanghai, China, is currently a AE Director of Power Module SiC and IGBT at onsemi, bringing experience from previous roles at Eaton, Intel and Philips Lighting. Bo Feng holds a 2000 - 2004 . With a robust skill set that includes Embedded Systems, Semiconductors, Electronics, Simulations, Analog and more, Bo Feng contributes valuable insights to the industry. Bo Feng has 2 emails on RocketReach.
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