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Bin Wei Location
Shanghai, CN
Bin Wei Work
2021 -now Software Engineering Director @
2011 -2021 Engineering Manager @
2006 -2011 Application Engineer @
2005 -2006 Software Engineer @
2005 -2005 Graphic Card BIOS SW Engineer @
2003 -2005 Software Engineer @ MITAC SH
Bin Wei Education
Northeastern University (CN)
Bachelor's degree (Electrical, Electronic and Communications Engineering Technology/Technician)
1999-2003
Bin Wei Skills
PCIe
Silicon
Processors
Microarchitecture
Functional Verification
Cloud Architecture Design
X86 Virtualization
Power Management
Cloud Computing
Linux
Low-power Design
Microprocessors
Embedded Software
Java
Project Management
Microsoft Office
Business Analysis
Low Power Design
Engineering
Software
InDesign
Bin Wei Summary
Bin Wei, based in Shanghai, CN, is currently a Software Engineering Director at Intel Corporation. Bin Wei brings experience from previous roles at 英特尔, Intel Corporation and XGI. Bin Wei holds a 1999 - 2003 Bachelor's degree in Electrical, Electronic and Communications Engineering Technology/Technician @ Northeastern University (CN). With a robust skill set that includes PCIe, Silicon, Processors, Microarchitecture, Functional Verification and more. Bin Wei has 3 emails on RocketReach.
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