Bin Cheng Email
VP of product management and engineering @ RayShape Medical Technology
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Bin Cheng Location
- Nanjing, Jiangsu, China
Bin Cheng Work
- 2025 -now VP of product management and engineering @
- 2021 -now Director of Digital and AI Product @
- 2018 -2021 Director Of Engineering @
- 2016 -2017 Technical Executive @
- 2015 -2016 Technical Account Manager @
- 2014 -2015 Senior Technology Manager @
- 2013 -2013 Director @
- 2010 -2012 Chief Architect @
- 2008 -2010 Solution Architect @
- 2006 -2008 System Engineer @
- 2004 -2006 Mobile Intelligent Network App Developer @
Bin Cheng Education
- University of Electronic Science and Technology
Master (pattern recognition and intelligence system)
2001-2004 - Zhengzhou University
Bachelor (Automatic control)
1997-2001
Bin Cheng Skills
- SDP
- CI
- Requirements Analysis
- Network Architecture
- Project Management
- Leadership
- SIP
- MVNO
- Microsoft Excel
- BSS
- Wireless
- Automation
- RCS
- Messaging
- IOT
- IMS
- Test Automation
- Solution Architecture
- Deep Packet Inspection
- IMS DB/DC
- Integration
- Java
- Bss/Oss
- VAS
- Cloud Computing
- Pcef/Pcrf
- Management
- Service Delivery
- Mobile Devices
- Project Delivery
- Customer Service
- GSM
- Engineers
- M2m
- Telecommunications
- Quality Assurance
- SS7
- LTE
- OCS
- MVNE
- Multicultural
- Unified Communications
- Microsoft Office
- Intelligent Networks
Bin Cheng Summary
- Bin Cheng, based in Nanjing, Jiangsu, China, is currently a VP of product management and engineering at RayShape Medical Technology. Bin Cheng brings experience from previous roles at GE HealthCare, Cisco and Cisco Jasper. Bin Cheng holds a 2001 - 2004 Master in pattern recognition and intelligence system @ University of Electronic Science and Technology. With a robust skill set that includes SDP, CI, Requirements Analysis, Network Architecture, Project Management and more. Bin Cheng has 1 emails on RocketReach.
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Bin Cheng
VP of product management and engineering
Nanjing, Jiangsu, China
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