Bin Cao Email
Vice President @ United Imaging Healthcare
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Bin Cao Location
- Shanghai, China
Bin Cao Work
- 2019 -now Vice President @
- 2017 -2019 Director of Engineering @
- 2014 -2017 Engineering Manager and System Architect @
- 2012 -2014 Senior Engineer and Team Leader @
- 2008 -2012 Senior Hardware Engineer @
Bin Cao Education
- 清华大学
博士 (Electrical, Electronics and Communications Engineering)
2022-2026 - Tsinghua University
Master (Electrical Engineering)
2005-2008 - Tsinghua University
Bachelor (Electrical Engineering)
2001-2005
Bin Cao Skills
- Hardware Architecture
- MRI
- Power Electronics
- Telecommunication Industry
- Hardware Design
- Signal Integrity
- High Speed Design
- RF Engineering
- Firmware
- Schematic Capture
- PCB design
- Telecommunications
- Engineering
- Industrialization
Bin Cao Summary
- Bin Cao, based in Shanghai, China, is currently a Vice President at 上海联影医疗科技股份有限公司. Bin Cao brings experience from previous roles at 上海联影医疗科技股份有限公司 and Cisco Systems. Bin Cao holds a 2022 - 2026 博士 in Electrical, Electronics and Communications Engineering @ 清华大学. With a robust skill set that includes Hardware Architecture, MRI, Power Electronics, Telecommunication Industry, Hardware Design and more. Bin Cao has 1 emails on RocketReach.
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