Bill Trinh Email & Phone Number
Application Engineer @ DynAmp
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Bill Trinh Location
- Columbus, OH, US
Bill Trinh Work
- Application Engineer @ (May 2024 - Present)
- Langsam Library Student Worker @ (January 2023 - May 2024)
- Sustaining Engineering Co-Op @ Crane ChemPharma & Energy (May 2023 - August 2023)
- Engineer Intern @ AquiSense Technologies (January 2022 - December 2022)
- Peer Tutor @ (August 2021 - December 2021)
- Computer Numerical Control Programmer @ (December 2020 - July 2021)
- Tutor @ (June 2018 - August 2020)
Bill Trinh Education
- University of Cincinnati - College of Engineering and Applied Science
Bachelor of Science (Mechanical Engineering)
2019-2024 - Australian International School
International Baccalaureate
2017-2019
Bill Trinh Skills
- 3D Printing
- AutoCAD
- Autodesk Fusion 360
- Creo Parametric
- Engineering
- Finite Element Analysis (FEA)
- Geometric Dimensioning & Tolerancing
- MATLAB
- Nastran
- Pitagora
- Project Management
- Python (Programming Language)
- SOLIDWORKS
- Science
- Siemens NX
- Tolerance Analysis
- Visual Basic for Applications (VBA)
Bill Trinh Summary
- Bill Trinh, based in Columbus, OH, US, is currently a Application Engineer at DynAmp. Bill Trinh brings experience from previous roles at University of Cincinnati, Crane ChemPharma & Energy and AquiSense Technologies. Bill Trinh holds a 2019 - 2024 Bachelor of Science in Mechanical Engineering @ University of Cincinnati - College of Engineering and Applied Science. With a robust skill set that includes 3D Printing, AutoCAD, Autodesk Fusion 360, Creo Parametric, Engineering and more. Bill Trinh has 1 emails on RocketReach.
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