Bill Rundle Email
Hardware Group Lead
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Bill Rundle Location
- Auburn, CA, US
Bill Rundle Work
- 2013 -now Hardware Group Lead @ The Boeing Company Secure Computing Systems
- 1998 -2013 Senior Director of Systems Engineering @
- 1996 -1999 Senior Engineering Manager @ White Eagle Systems
- 1996 -1996 Senior Program Manager @
- 1991 -1996 Senior Engineering Manager @
Bill Rundle Education
- New Mexico State University
Bachelor of Science in Electrical Engineering (Computer Engineering)
1980-1983
Bill Rundle Skills
- Cross-functional Team Leadership
- Engineering
- Embedded Systems
- EDA
- ASIC
- Distributed Systems
- Embedded Software
Bill Rundle Summary
- Bill Rundle, based in Auburn, CA, US, is currently a Hardware Group Lead at The Boeing Company Secure Computing Systems. Bill Rundle brings experience from previous roles at Boeing, White Eagle Systems, Fujitsu and Lockheed Martin. Bill Rundle holds a 1980 - 1983 Bachelor of Science in Electrical Engineering in Computer Engineering @ New Mexico State University. With a robust skill set that includes Cross-functional Team Leadership, Engineering, Embedded Systems, EDA, ASIC and more. Bill Rundle has 1 emails on RocketReach.
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