Product Manager for Bonding Technology. Over 20+ years in Bonding Technology
Work with TSV technology for 4 years
Product Manager for Aligners and Coaters for 10 years
MEMS
Semiconductors
Semiconductor Industry
Electronics
Design of Experiments
Metrology
IC
Product Engineering
Engineering Management
Thin Films
Characterization
SPC
Silicon
Sensors
Optics
R&D
Failure Analysis
Analog
Embedded Systems
Mixed Signal
Materials Science
Photolithography
Nanotechnology
Over 20+ Years in Bonding Technology
Product Manager for Bonding Technology
Bill Crouch Summary
Bill Crouch, based in Peoria, AZ, US, is currently a Sr. Process Engineer at Ostendo Technologies. Bill Crouch brings experience from previous roles at SUSS MicroTec. Bill Crouch holds a 1989 - 1994 BS Electrical Engineering @ Arizona State University. With a robust skill set that includes Product Manager for Bonding Technology. Over 20+ years in Bonding Technology, Work with TSV technology for 4 years, Product Manager for Aligners and Coaters for 10 years, MEMS, Semiconductors and more. Bill Crouch has 2 emails on RocketReach.
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