Manager, Simulation and Characterization @ LSI Logic (January 1988 - January 1992)
Staff Technologist @ (January 1986 - January 1988)
Bidyut Sen Education
Stony Brook University
Doctor of Philosophy (Ph.D.) (Physics)
1979-1986
Indian Institute of Technology Kanpur
Master of Science (M.Sc.) (Physics)
1977-1979
Bidyut Sen Skills
ASIC
Assembly
Electrical
Flip Chip
Hardware
High Speed Design
MCMS
Mechanical
Microprocessors
PCB design
Packaging
Reliability
Semiconductors
Signal Integrity
Supplier Management
TSV
Thermal Analysis
Heat
Assembly Language
Interfaces
Solutions
Materials
Sink
Thermal
Optimization
Lsi
Bidyut Sen Summary
Bidyut Sen, based in Milpitas, CA, US, is currently a Director, Semiconductor Packaging and PCB Technology at Oracle. Bidyut Sen brings experience from previous roles at Oracle, Fujitsu Computer Packaging Technology and LSI Logic. Bidyut Sen holds a 1979 - 1986 Doctor of Philosophy (Ph.D.) in Physics @ Stony Brook University. With a robust skill set that includes ASIC, Assembly, Electrical, Flip Chip, Hardware and more. Bidyut Sen has 1 emails and 2 mobile phone numbers on RocketReach.
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