Principal Hardware Engineer @ (October 2008 - April 2010)
Sr Hardware Design Engineer (Implementation Lead) @ (October 2005 - January 2008)
Staff Engineer @ (January 1999 - September 2005)
MTS engineer @ (August 1997 - December 1999)
Maintenence Engineer @ Philips Components (January 1991 - January 1997)
Bhupesh Balakrishnan Education
CDAC, Pune
Dipl in VLSI design (HDL & Logic design)
1996-1997
Savitribai Phule Pune University
BE E&TC (Electronics & Telecom)
1991-1996
Cusrow Wadia Inst of Technology
DERE (Electronics)
1989-1991
Bhupesh Balakrishnan Skills
Chip level planning
Cpu implementation and physical design
Floorplanning
High speed clock planning & implementation
Physical Design
SoC
Timing Closure
Cse
Marketing
Strategic Planning
Microsoft Office
Microwave
Business Analysis
Bhupesh Balakrishnan Summary
Bhupesh Balakrishnan, based in Santa Clara, CA, US, is currently a Vice President Silicon Engineering at Ampere. Bhupesh Balakrishnan brings experience from previous roles at Ampere, Veloce Technologies + Applied Macro , Oracle and Montalvo Systems Inc. Bhupesh Balakrishnan holds a 1996 - 1997 Dipl in VLSI design in HDL & Logic design @ CDAC, Pune. With a robust skill set that includes Chip level planning, Cpu implementation and physical design, Floorplanning, High speed clock planning & implementation, Physical Design and more. Bhupesh Balakrishnan has 2 emails and 1 mobile phone numbers on RocketReach.
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