Benjamin Tait Email & Phone Number

Firmware Engineer @ Intel Corporation

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Benjamin Tait Location

Sacramento, CA, US

Benjamin Tait Work

2022 - now Firmware Engineer @ Intel Corporation
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2021 - 2022 SW Engineering LDP Asc @ Lockheed Martin
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2020 - 2021 Software Engineer Associate @ Lockheed Martin
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2020 - 2020 Operating System Intern - R and D @ CertiK
2019 - 2019 Teaching Assistant For Microprocessors and Data Conversion @ University of Rochester
2019 - 2019 Firmware Engineer Intern @ PerkinElmer, Inc.
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2018 - 2018 Teaching Assistant for Introduction to Signals and Circuits @ University of Rochester
2018 - 2018 Research Assistant @ University of Rochester

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Benjamin Tait Education

University of Colorado Boulder
Master's degree (Embedded Systems Engineering)
2022 - 2024
Cornell University
(Systems Engineering)
2021 - 2022
University of Rochester
Bachelor of Science (BS) (Electrical and Computer Engineering)
2016 - 2020

Benjamin Tait Summary

Benjamin Tait, based in Sacramento, CA, US, is currently a Firmware Engineer at Intel Corporation. Benjamin Tait brings experience from previous roles at Lockheed Martin, CertiK and University of Rochester. Benjamin Tait holds a 2022 - 2024 Master's degree in Embedded Systems Engineering @ University of Colorado Boulder. Benjamin Tait has 3 emails on RocketReach.

Benjamin Tait Emails

Found 3 emails

Benjamin Tait Phone Numbers

Found 1 phone numbers

+1 646-590-XXXX

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