Benjamin Kaplan Location
Chicago, IL, US
Benjamin Kaplan Work
Benjamin Kaplan Education
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Benjamin Kaplan Summary
Benjamin Kaplan, based in Chicago, IL, US, is currently a Vice President of Manufacturing at Field Packaging Solutions. Benjamin Kaplan brings experience from previous roles at Field Packaging Solutions, Hilco Streambank and Hilco Valuation Services, LLC. Benjamin Kaplan holds a 2022 - 2025 The University of Chicago Booth School of Business. With a robust skill set that includes Marketing, Sustainability, Business Development, International Development, Energy and more. Benjamin Kaplan has 3 emails and 1 mobile phone numbers on RocketReach.