Project Engineer @ Tegrant Corporation (April 2005 - September 2007)
Package Engineer - Co-Op @ (June 2004 - December 2004)
Ben Vanderplas Education
Northwestern University
Masters (Engineering Management)
2010-2013
Michigan State University
BS (Packaging)
2000-2004
The University of Chicago Booth School of Business
Ben Vanderplas Skills
Packaging
Product Development
Continuous Improvement
Project Management
Strategy
Packaging Engineering
Product Management
Manufacturing
Cross-functional Team Leadership
Process Improvement
Leadership
Supply Chain Management
Engineering Management
Engineering
GMP
Supply Chain
Ista
Cross Functional Team Leadership
Pda
Ben Vanderplas Summary
Ben Vanderplas, based in Arlington Heights, IL, US, is currently a Director of Engineering and R and D at ThermoSafe. Ben Vanderplas brings experience from previous roles at Sonoco and Sonoco (Tegrant Corporation). Ben Vanderplas holds a 2010 - 2013 Masters in Engineering Management @ Northwestern University. With a robust skill set that includes Packaging, Product Development, Continuous Improvement, Project Management, Strategy and more. Ben Vanderplas has 1 emails and 1 mobile phone numbers on RocketReach.
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