Manager assemblage RF and MW @ (February 2021 - February 2023)
Technicien RF and MW @ (April 2015 - January 2019)
Aurélien Bailly Education
IUT 'A' Lille I
DUT Génie Électrique et Informatique Industrielle
2013-2015
Aurélien Bailly Skills
Die Attach
Flip Chip Bonding
Gestion du temps
Anglais
Gold Wire Bonding Wedge
Laser Etching And Milling
Gold Wire Bonding
Automated and Manual Die Bonding
Mmics
Automated and Manual Wire Bonding
Low and High Temperature Soldering
Aurélien Bailly Summary
Aurélien Bailly, based in Lille, FR, is currently a Responsable technique - Ingénierie industrielle at MC2 Technologies. Aurélien Bailly brings experience from previous roles at MC2 Technologies. Aurélien Bailly holds a 2013 - 2015 DUT Génie Électrique et Informatique Industrielle @ IUT 'A' Lille I. With a robust skill set that includes Die Attach, Flip Chip Bonding, Gestion du temps, Anglais, Gold Wire Bonding Wedge and more.
Looking for a different Aurélien Bailly?
Find contact details for 700 million professionals.