Aska Tseng Email
Senior Engineer @ Dynapack Technology
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Aska Tseng Location
- Taipei City, Taiwan
Aska Tseng Work
- Senior Engineer @ (October 2018 - Present)
- Firmware Engineer @ Lin-Ker Technology Co., Ltd. (January 2015 - August 2018)
- FAE @ Lontium Semiconductor Corp (May 2013 - January 2015)
- Technical group leader @ Retronix (July 2007 - May 2013)
Aska Tseng Education
- Huafan University
Master's Degree (Mechanical Engineering)
2001-2003 - Huafan University
Bachelor's Degree (Mechanical Engineering)
1995-2001
Aska Tseng Skills
- Firmware
- Embedded Systems
- Protocol Analyzer And Debugging
- C
- Customer Exploration And Expansion
- Vesa/Cea/Hdmi/Displayport/Mhl/Usb Application
Aska Tseng Summary
- Aska Tseng, based in Taipei City, Taiwan, is currently a Senior Engineer at Dynapack Technology. Aska Tseng brings experience from previous roles at Lin-Ker Technology Co., Ltd., Lontium Semiconductor Corp and Retronix. Aska Tseng holds a 2001 - 2003 Master's Degree in Mechanical Engineering @ Huafan University. With a robust skill set that includes Firmware, Embedded Systems, Protocol Analyzer And Debugging, C, Customer Exploration And Expansion and more.
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