Arnab Choudhury Email & Phone Number
IC Package Integration Engineer @ Apple
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Arnab Choudhury Location
- California, United States
Arnab Choudhury Work
- IC Package Integration Engineer @ (May 2024 - Present)
- Product Design Architect (Thermal Systems) @ (July 2016 - May 2024)
- Senior Thermal Packaging Engineer @ (April 2011 - June 2016)
- Senior Process Engineer @ (January 2008 - March 2011)
- Graduate Research Assistant @ (August 2001 - November 2007)
- Summer Intern @ (May 2004 - August 2004)
Arnab Choudhury Education
- Georgia Institute of Technology
PhD (Mechanical Engineering)
2003-2007 - Georgia Institute of Technology
MS (Mechanical Engineering)
2001-2003 - Indian Institute of Technology, Kharagpur
B.Tech (Honors) (Manufacturing Science and Engineering)
1997-2001
Arnab Choudhury Skills
- Architecture
- Electronics Packaging
- Computational Fluid Dynamics (CFD)
- Thermal Analysis
- MEMS
- Electronics
- Process Simulation
- Metrology
- Nanotechnology
- Manufacturing
- Characterization
- SEM
- Process Engineering
- Design of Experiments
- Sensors
- Materials Science
- Simulations
- Statistical Data Analysis
- Project Management
- Process Control
- ANSYS
- Matlab
- Labview
- AutoCAD
- Pro Engineer
- Microfabrication
- Stereolithography
Arnab Choudhury Summary
- Arnab Choudhury, based in California, United States, is currently a IC Package Integration Engineer at Apple. Arnab Choudhury brings experience from previous roles at Apple, Intel Corporation and Georgia Institute of Technology. Arnab Choudhury holds a 2003 - 2007 PhD in Mechanical Engineering @ Georgia Institute of Technology. With a robust skill set that includes Architecture, Electronics Packaging, Computational Fluid Dynamics (CFD), Thermal Analysis, MEMS and more. Arnab Choudhury has 3 emails and 1 mobile phone numbers on RocketReach.
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