Anthony Tan Email & Phone Number
Materials Commodity Lead – Wafer Level Assembly and Advanced Packaging @ Intel Corporation
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Anthony Tan Location
- Portland, OR, US
Anthony Tan Work
- 2025 -now Materials Commodity Lead – Wafer Level Assembly and Advanced Packaging @
- 2022 -2025 Advanced Packaging Supply Chain R and D Engineer @
- 2019 -2022 Research Investigator and Technical Sourcing Specialist @
- 2016 -2019 Senior Product Development Chemist @
- 2011 -2016 NSF Graduate Research Fellow, Materials Science @
- 2010 -2016 Project Lead @ Wright Materials Research Company
- 2008 -2010 Engineering Intern @
- 2006 -2008 Research Engineering Intern @ Wright Materials Research Company
Anthony Tan Education
- Northwestern University
Doctor of Philosophy (Ph.D.) (Materials Science and Engineering)
2011-2016 - Northwestern University
BS (Materials Science and Engineering)
2009-2011 - The Ohio State University
BS (Materials Science and Engineering)
2007-2009
Anthony Tan Skills
- Scanning Electron Microscopy
- Materials Science
- Nanotechnology
- Engineering
- Polymers
- Composites
- Matlab
- Microsoft Office
- Product R&D
- Experimental Design
- Technical Writing
- Materials
- Optical Microscopy
- Characterization
Anthony Tan Summary
- Anthony Tan, based in Portland, OR, US, is currently a Materials Commodity Lead – Wafer Level Assembly and Advanced Packaging at Intel. Anthony Tan brings experience from previous roles at Intel, DuPont, Dow and Northwestern University. Anthony Tan holds a 2011 - 2016 Doctor of Philosophy (Ph.D.) in Materials Science and Engineering @ Northwestern University. With a robust skill set that includes Scanning Electron Microscopy, Materials Science, Nanotechnology, Engineering, Polymers and more. Anthony Tan has 4 emails and 1 mobile phone numbers on RocketReach.
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