Angelo S. Email
Senior Safety Engineer @ Microchip Technology Inc.
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Angelo S. Location
- United States
Angelo S. Work
- Senior Safety Engineer @ (January 2024 - Present)
- EHS Consultant @ (November 2019 - January 2024)
- Public Health Scientist @ Idaho Bureau of Laboratories (August 2017 - October 2019)
- Graduate Researcher @ (May 2016 - August 2017)
- Graduate Research And Teaching Assistant @ (January 2015 - May 2016)
Angelo S. Education
- Boise State University
Master of Science - MS (Microbiology, General)
2015-2018 - Boise State University
Bachelor of Science - BS (Biology, Microbiology)
2013-2015 - College of Western Idaho
Associate of Science - AS (Biology, General)
2011-2013
Angelo S. Skills
- Accident investigation
- Analytical Chemistry
- Computer Hardware Troubleshooting
- Data analysis
- Environment, Health, and Safety (EHS)
- Environmental Microbiology
- Environmental compliance
- Field Sampling
- HAZWOPER
- Hardware Diagnostics
- Hazard Recognition
- Hazard analysis
- Hazardous Waste Management
- Hazardous materials
- Microbiology
- Molecular Biology
- Project Management
- Project planning
- Quality, Health, Safety, and Environment (QHSE)
- Real-Time Polymerase Chain Reaction (qPCR)
- Research and Development (R&D)
- Risk Assessment
- Sampling
- Staff Training
- Standard Operating Procedure (SOP)
- Statistical Data Analysis
- Statistical Reporting
- Supervisory skills
- Technical Writing
- Technical presentations
- Troubleshooting
- Workplace safety
Angelo S. Summary
- Angelo S., based in United States, is currently a Senior Safety Engineer at Microchip Technology Inc.. Angelo S. brings experience from previous roles at BSI, Idaho Bureau of Laboratories and Boise State University. Angelo S. holds a 2015 - 2018 Master of Science - MS in Microbiology, General @ Boise State University. With a robust skill set that includes Accident investigation, Analytical Chemistry, Computer Hardware Troubleshooting, Data analysis, Environment, Health, and Safety (EHS) and more. Angelo S. has 2 emails on RocketReach.
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