Andy Ding Email & Phone Number
Hardware Engineer @ Microsoft
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Andy Ding Location
- Boise, ID, US
Andy Ding Work
- 2024 -now Hardware Engineer @
- 2021 -2024 CXL System Product Engineer @
- 2020 -2021 SSD Hardware Design Lead @
- 2018 -2020 SSD System Engineer @
- 2014 -2018 Product Engineer @
- 2011 -2014 Product Development Engineer @
- 2008 -2011 Software Engineer @
- 2004 -2008 Quality and Reliability Engineer @
Andy Ding Education
- City University of Hong Kong
Master of Philosophy (MPhil) (Semiconductor Physics and Material)
2001-2004 - Fudan University
Bachelor's degree (Semiconduct Physics)
1997-2001
Andy Ding Skills
- Embedded Software
- Engineering Management
- Ufs
- Mphy
- C
- Debugging
- Emmc
- Perl
- Electronics
- ASIC
- SATA
- FMEA
- Verilog
- JMP
- USB
- Product Engineering
- NPI
- Mixed Signal
- Embedded Systems
- Semiconductor Industry
- FPGA
- Design of Experiments
- Manufacturing
- SoC
- C++
- Failure Analysis
- Python
- Semiconductors
- Project Management
- SPC
- WPF
- COM
- C#
- Flash Memory
- Yield
- IC
Andy Ding Summary
- Andy Ding, based in Boise, ID, US, is currently a Hardware Engineer at Microsoft. Andy Ding brings experience from previous roles at Micron Technology. Andy Ding holds a 2001 - 2004 Master of Philosophy (MPhil) in Semiconductor Physics and Material @ City University of Hong Kong. With a robust skill set that includes Embedded Software, Engineering Management, Ufs, Mphy, C and more. Andy Ding has 1 emails on RocketReach.
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