Andy Carrasco Location
California, United States
Andy Carrasco Work
- 2026 - now Package Design Lead Engineer @ Google
- 2019 - 2026 ASIC Engineering Technical Leader @ Cisco
- 2017 - 2019 Principal Package Engineer @ eSilicon
- 2016 - 2017 Sr. IC Package Engineer @ Samtec Inc
- 2012 - 2016 Owner and Principal Design Engineer @ Flexetch
- 2009 - 2012 Chief Technology Officer and Product Manager @ Nippon Sentia Co., Ltd.
- 2006 - 2009 Programming Department Manager and Software Architect @ Nagase & Co., Ltd.
- 1997 - 2005 Design Manager and Field Applications Engineer and Director of Sales @ CAD Design Software
Andy Carrasco Education
- Temple University Japan
MBA (Business Administration)
2007 - 2009 - University of California, Berkeley
Bachelor of Arts (B.A.) (Architecture)
1992 - 1996
Andy Carrasco Skills
- CAD
- Semiconductors
- EDA
- Product Design
- Electronics
- PCB design
- Manufacturing
- User Interface Design
- Software Development
- Rendering
Andy Carrasco Summary
Andy Carrasco, based in California, United States, is currently a Package Design Lead Engineer at Google. Andy Carrasco brings experience from previous roles at Cisco, eSilicon, Samtec Inc and Flexetch. Andy Carrasco holds a 2007 - 2009 MBA in Business Administration @ Temple University Japan. With a robust skill set that includes CAD, Semiconductors, EDA, Product Design, Electronics and more. Andy Carrasco has 4 emails and 3 mobile phone numbers on RocketReach.
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