Andy Carrasco Email & Phone Number
Package Design Lead Engineer @ Google
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Andy Carrasco Location
- California, United States
Andy Carrasco Work
- 2026 -now Package Design Lead Engineer @
- 2019 -2026 ASIC Engineering Technical Leader @
- 2017 -2019 Principal Package Engineer @
- 2016 -2017 Sr. IC Package Engineer @
- 2012 -2016 Owner and Principal Design Engineer @
- 2009 -2012 Chief Technology Officer and Product Manager @
- 2006 -2009 Programming Department Manager and Software Architect @ Nagase & Co., Ltd.
- 1997 -2005 Design Manager and Field Applications Engineer and Director of Sales @
Andy Carrasco Education
- Temple University Japan
MBA (Business Administration)
2007-2009 - University of California, Berkeley
Bachelor of Arts (B.A.) (Architecture)
1992-1996
Andy Carrasco Skills
- CAD
- Semiconductors
- EDA
- Product Design
- Electronics
- PCB design
- Manufacturing
- User Interface Design
- Software Development
- Rendering
- Project Management
- Product Development
- Program Management
- AutoCAD
- RF
- Start-ups
- R&D
- Strategy
- Semiconductor Industry
- Design for Manufacturing
- Engineering Management
- IC packaging
- Simulations
- Radio Frequency Rf
- Sales
- Start Ups
- Applications
- Spares
- Software
- Operations
- Computer Aided Design Cad
- Design
- Research
- Radio Frequency
- Computer Aided Design
Andy Carrasco Summary
- Andy Carrasco, based in California, United States, is currently a Package Design Lead Engineer at Google. Andy Carrasco brings experience from previous roles at Cisco, eSilicon, Samtec Inc and Flexetch. Andy Carrasco holds a 2007 - 2009 MBA in Business Administration @ Temple University Japan. With a robust skill set that includes CAD, Semiconductors, EDA, Product Design, Electronics and more. Andy Carrasco has 1 emails and 4 mobile phone numbers on RocketReach.
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