Andrew Technologies Inc Information

As a provider of circuit board assembly services, Andrew Technologies, Inc. works with rigid board constructions, featuring through-hole and surface mount technology to meet circuit board needs for commercial, industrial controls, power distribution boards, and other electronics, telecommunications, medical and manufacturing applications. Our facility features semi-automated assembly, working with board thicknesses from 0.031" to 0.25", from 1 board layer to 24 board layers. Our wave soldering capabilities range from 1.5" wide up to 18" wide, while our reflow soldering capabilities range from 0.5" to 18" wide. Circuit assembly features that we are experienced in achieving include fine pitch, surface mount, BGA, QFP, QFN, and micro-BGA. We also provide extensive secondary and support services, including device programming, functional testing, solder screen printing, minor cable assemblies, and x-ray. We can provide rework or modification of existing circuit boards as well. In addition, we can provide special packaging for your finished products.