AMPC Inc Competitors

Chip Scale Review is a semiconductors company based out of United States.

Omni-Tec, Inc as manufacturers' representatives, has serviced industrial companies in the Upper Midwest since 1979. Omni-Tec has represented top-of-the-line principals to meet the ever changing needs of it's customers with state of the art products ranging from semiconductor assembly equipment to surface mount assembly equipment and materials.

Semi-Pac is a global semiconductor engineering and packaging company headquartered in Silicon Valley, California with production facilities in Silicon Valley and Singapore. Semi-Pac specializes in quick turn high yield semiconductor assembly applications for prototype through production. Established in 1988, Semi-Pac is experienced in all aspects of assembly and can meet your most demanding assembly requirements. Semi-Pac has an excellent quality record in supplying many top semiconductor manufacturers with its advanced fine pitch wire bonding capabilities and equipment. Semi-Pac supports its customers with a full range of engineering services: Prototype burn-in and reliability testing Electromigration testing Process development Package / substrate design 3D modeling with finite element analysis Equipment or tooling design and manufacture Prototype and volume manufacturing Semi-Pac has worked on projects including: Ultra-low Cost Wafer Bumping Stacked Die Wafer Level Packaging Advanced Multi-Chip Modules, Systems on Chip (SoC) Many Other Advanced Semiconductor Packaging Applications. We have the experience, equipment, and clean room facilities to bring value and quality to your product or process.