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Amitava Das Location
Palatine, IL, US
Amitava Das Work
Vice President of Engineering @ (July 2024 - Present)
Co-Founder and COO @ (January 2023 - June 2024)
Co-Founder and CEO @ (April 2011 - January 2023)
Director @ (October 2009 - March 2011)
Director, Global Product and Test Engineering @ (January 2006 - September 2009)
Design Lead (RFIC and Module) @ (June 2000 - December 2005)
Device and Process Integration Engineer @ (December 1996 - May 2000)
Associate Professor of Electrical Engg @ (May 1994 - April 1996)
Assistant Professor of Electrical Engg @ (January 1991 - May 1994)
Amitava Das Education
Purdue University
Ph.D. (Electrical Engineering)
1986-1990
The University of Akron
MS (Electrical Engg)
1984-1986
Jadavpur University 1980-1984
Amitava Das Skills
IC
Semiconductors
CMOS
ASIC
Wireless
SoC
Testing
RF
Mixed Signal
Management
Engineering
Strategic Planning
Business Development
Chain
Tags
Patent Applications
R
Blocks
Publications
Market
Readers
ZigBee
Sige
Out Of the Box
C
Qualification
Motorola
Freescale
Philadelphia
Applications
Students
Full Cycle
WCDMA
Explore
Seattle
Modeling
ERP
Circuits
DAS
Module Development
GSM
Symposium
UHF
Middleware
Geneva
Warehouse Management
India
Program Management
Uwb
Manufacturing
Circuit
Indian
VCO
Radio
Project
Switzerland
Texas
Process Technology
IEEE
Simulations
Design
Research
Cellular Communications
Analytics
Technology Trends
Paper
Presentations
Analysis
RFID
Yield
Amitava Das Summary
Amitava Das, based in Palatine, IL, US, is currently a Vice President of Engineering at GlobalFoundries. Amitava Das brings experience from previous roles at Tagore Technology, MaxLinear and Freescale. Amitava Das holds a 1986 - 1990 Ph.D. in Electrical Engineering @ Purdue University. With a robust skill set that includes IC, Semiconductors, CMOS, ASIC, Wireless and more. Amitava Das has 2 emails and 2 mobile phone numbers on RocketReach.
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